Equipotential Bonding on Cable Tray Systems for Ex Zone 2/22
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The equipotential bonding system is mounted on cable tray systems. All conductive system parts and electrical equipment are integrated in the Ex equipotential bonding by means of equipotential bonding plates and clamps as well as a closed ring equipotential bonding conductor.
EB clamp for cable trays and EB plate
Equipotential bonding clamp for cable trays
- Connection only with ring equipotential bonding conductor (tinned copper cable)
- For mounting on the perforated cable tray or on the equipotential bonding plate (PAP 1 / PAP 2)
- EB clamp to be mounted approx. every 0.5 m
6 Products
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